Flow assurance parameter and deposition monitoring techniques
Generic instrumentation modules provide interfaces to a wide range of variables using Cormon multi-sensor array technology m-SA.
Transducers are designed to provide information related to classical process variables, surface films/deposits and flow characteristics.
Primary variables include temperature (CEION®/RTD), pressure (piezo-resistive silicon) and stress (strain gauge technology).
Deposition monitoring includes surface conductivity (CEION® film) for detection of conductive deposits; solution conductivity and electric flux density(dielectric); luminous intensity(fibre-optic based photo-detectors) and heat transfer rate.
Flow monitoring includes wall shear stress and mass flow rate.
Application
This technology mix is applied to the study of real-time conditions and behaviour at the metal-solution interface related primarily to films and deposits and the inter-relationship with the process conditions. These areas could include work related to biofilms, iron sulphide scales, iron carbonate scales, hydrates, wax and asphaltenes. Some outputs are qualitative and require specialist cognitive interpretation.
